Mobility is the driving force in electronics. Analysts see the strongest growth in semiconductors and sensors for mobile devices. Accordingly, the cloud servers need to be equipped with sufficient performance and functionality to support the huge user base.
Functionality and performance of mobile devices is continuously increasing. Combined with the trend to reduce form factors, this requires small and highly integrated packages: WLSCP, PoP, 2.5D and 3D. To comply with the requirements for functionality and performance, the highly integrated packages contain heterogeneous stacks. 3D packages may contain memory, sensors, logic and RF. The demand for smartphones, tablets and ultra books requires high volumes of semiconductors and sensors, but in a fast-changing consumer market the ASPs, and therefore, the production costs are critical.
ICs and sensors for mobile applications have special test requirements and test handling needs to ensure high throughput and high yields to achieve best cost of test. In addition to the mechanical challenges caused by the smallest form factors and fragile packages combined with high pin counts, thermal issues resulting from the package density need to be managed. Contactors and PCBs need to deliver best electrical and mechanical performance to meet the requirements of small and highly integrated ICs.
Mobility has challenging requirements. Best overall test performance can be achieved if all test cell elements are harmonized. Optimal performance of the overall system count in the end. Totally integrated solution will optimize investment cost, cost of test and test yield. Multitest provides advanced test solutions that meet these special requirements.