The semiconductor test cell is a complicated environment that creates challenges for the transmission of electrical signals. The resources necessary to power and verify device functionality require large handling and testing equipment. Signals from the test equipment must travel long distances and through a variety of interfaces to reach the device. Slow speed signals with minimal loading can be sourced from a distance, however high power must be supported near the device. This requires an intelligently designed interface that pays close attention to signal and power integrity.
Signal integrity defines the high frequency performance of a test cell. It is very important to the semiconductor test industry. The tutorial will begin with a general overview of several critical signal integrity parameters such as inductance, impedance, and bandwidth. The tutorial will then shift its focus to how signal integrity relates specifically to the test industry, with in-depth discussions about both the PCB and the contactor. This will equip engineers with the ability to determine when signal integrity issues may arise in their test environment and provide some insight on how to deal with these issues.
Power integrity has been given less attention than signal integrity, though is equally critical to the success of a test interface. High power, low voltage devices are extremely sensitive to the quality of the Power Delivery System & (PDS). A correctly designed PDS provides a stable voltage reference to the DUT. This tutorial will present an introduction to power integrity including critical concepts such as equivalent series inductance and PDS impedance. These concepts will then be applied to the semiconductor test cell environment, providing insight to when power integrity must be considered and how the test interface can be optimized to meet device requirements.