Wafer-level chip-scale package (WLCSP) devices are widely used because they offer low cost, small height and small footprint packages to be directly mounted into smartphones, tablet PCs, and other mobile devices. WLCSP devices are even being used in some automotive applications. The manufacturers of these mobility and automotive products are demanding very low defect parts per million (DPPM) from their suppliers of WLCSP devices. Today´s back end process for WLCSP is not satisfying this low DPPM quality requirement sufficiently and reliably. This is because there is no final test after singulation – a process that can damage a die and result in defective devices getting shipped to the field.