Traditionally final test of semiconductors at the full temperature range from cold (- 55°C) up to hot (+175°C) is strongly related to automotive applications.
Due to the nature of the end applications any failure would be a possible cause of most serious – even live-threatening – consequences.
Semiconductor industry has established strict quality standards e.g. 0-ppm programs, which in turn require highest accuracy and stability for testing at all temperature levels. On the other hand semiconductors for consumer applications were mainly driven by cost and the fast changing cycles. Therefore standard final test was usually done at ambient and ambient/hot temperature only to reduce the number of test insertions to a minimum and the complexity and cost of the test equipment.
Recent trends in the end markets changed the requirements for final test significantly: Consumer applications strongly related to the megatrend of “mobility” – being connected anytime, anywhere – pose new challenges on semiconductors in terms of performance and form factor. However, the cost pressure, the large volumes and the need for fast ramping is unchanged. In the automotive segment convenience and car entertainment features have been added to the classic safety applications. With that the borders between consumer and automotive seem to blur. Are the strict quality standards still applicable and affordable for car entertainment applications?
This presentation will give an overview of today’s temperature test requirements seen in classic automotive, car entertainment and convenience as well as on state-of-the-art consumer applications. Consequences for the test strategies will be discussed with a strong focus on cost of test and performance.