Issue: There are numerous papers and articles about 3D packages; however, they have not been able to conquer the volume production status. One common issue is how to ensure quality across the overall and more complex supply chain.
For assembly this means that stacking dies bears a much higher risk for failure than single die technologies. Bad parts in the stack will corrupt good ones. The worst scenario adds a cost-intensive component such as a memory on a stack, which is dysfunctional. The KGD concept can only partly solve this.
Solution: This presentation will discuss ways for a distributed test flow which compares the cost of test to the cost of non-testing with special references to the packaging process. Additionally, it will highlight the opportunities and challenges of distributed test strategies and analyze the best models for these test distributions and the special equipment requirements.
These new approaches will no longer be limited to the classic test areas — probing and final test. As many of the additional risks are related to the assembly process, this is the area were additional test insertions have to be considered. These test points will have different requirements than the established ones. The changed environment needs to be taken into account in terms of the test process itself. Secondly, the device to be tested will be very sensitive as it is not finally packaged.
The most appropriate equipment will be discussed: What are the limitations of using probing tools or deploying final test equipment? Which strategy will offer the most synergies and reduce cost of test in the end?
Finally, an analogy with the MEMS will give an interesting perspective on how to leverage the expertise that has been gained during the last decade.